Manhattan ICPU-GREASE20G - Thermoconductive paste for CPU 20G

Manhattan ICPU-GREASE20G

Thermoconductive paste for CPU 20G

The heat-conducting paste helps to create maximum conductivity between the microprocessor and the CPU heatsink to reduce the risk of overheating. Specially designed to reliably and easily cover construction defects and to close critical gaps that can reduce cooling efficiency and increase potential damage.

Features of Thermoconductive paste

• Increases thermal conductivity between the CPU and the heatsink
• Helps dissipate heat, prolonging the life of the CPU
• Preloaded in a syringe with cap for easy and precise application
• Designed for multiple applications
• Color: gray
• Thermal conductivity: >0.965 W/MK
• Thermal impedance: < 0.255°C-IN2/W
• Specific weight: >2.3
• Evaporation: < 0.001%
• Leakage: < 0.05%
• Dielectric constant A: >5.1
• Thixotropic index: 380 ±10 1/10 mm
• Operating temperature: -30 – 180°C
• Physical characteristics
• Syringe with resealable cap
• 20 g
• Composition
• Silicone compounds, 50%
• Carbon compounds, 20%
• Metal oxide compounds, 30%

The set contents

1x Manhattan ICPU-GREASE20G - Thermoconductive paste for CPU 20G